**A*STAR Scientific Equipment Finder**

Bonding: BR-BON-BondTester

equipment

Institute of Microelectronics (IME)

What is it?
BR-BON-BondTester

Manufacturer: EVG

Model Name: 20

Applications: Polished 200 & 300mm Si wafer

Instrument Overview: *Fast inspection method *Infrared inspection system *Bond strength measurement for bonded wafer (Maszara test) * IR live image *One-shot high-resolution inspection of the entire bonded wafer

Technical features and specifications:
*Void size detection down to 500 µm radius

Charges:
NA

Instrument Manufacturer URL: NA

Detailed Specifications:
NA

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Bonding: BR-BON-BondTester

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