Etching: ICP-F (Oxford OIPT Plasmalab System)

 What is it? 
   A tool for dielectric and metal etch
 
  Manufacturer:  Oxford Instruments
 
  Model Name:  OIPT Plasmalab System 100
 
  Applications:  Dielectric etch, Metal etch
  
  Instrument Overview:  ICP-RIE (Inductive Coupled Plasma Reactive Ion Etching) system consisting of 1 etching chamber and 1 loadlock chamber equipped with robot handling for wafer transfer. Single wafer loading system. Chlorine-based etching system equipped with in-situ endpoint detection technique for plasma dry etching. .
  
  Technical features and specifications: 
   WAFER SIZE: 8 inch
  Charges:
   User operated: NA/hour, Staff operated: NA/hour
 
  Instrument Manufacturer URL: https://www.oxinst.com/
 
  Detailed Specifications: 
   https://plasma.oxinst.com/technology/icp-etching/