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Lithography: BR-PHL-TSV-Stepper

equipment

Institute of Microelectronics (IME)

What is it?
Ultratech Stepper

Manufacturer: Ultratech

Model Name: AP 300

Applications: Capable of running 200 and 300mm wafer concurrently without mechanical changeover. Accept wide range of resist viscosity up to a few thousand CP. Able to perform photo resist and polyimide coating and developing in one system. TSV advance packaging

Instrument Overview: The Ultratech Stepper AP300 is a Litho exposure tool.

Technical features and specifications:
GHI-line broadband, 350nm to 450nm
Reticle size 6” x 6”
Warped wafer handling up to 250um.
Stage: Auto

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Instrument Manufacturer URL: NA

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Lithography: BR-PHL-TSV-Stepper

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