Lithography: Mask Aligner System (EVG 62008 Infinity)

 What is it? 
   A tool for aligning the mask to substrate.
 
  Manufacturer: EVG
 
  Model Name:  62008 Infinity
 
  Applications: Lithography
  
  Instrument Overview: The EVG6200 Alignment System is optimized for high throughput and high resolution top and bottom side splitfield. With double side alignment capability for soft/ hard/vacuum contact/proximity exposure. Equipped with manual alignment stage of 500 nm resolution.
Wafer Size: From small samples to 8-inch wafer
  
  Technical features and specifications: 
   • For 365 nm/405 nm broadband UV wavelength and 248 nm DUV wavelength • Constant power and dose exposure • Double-side mask alignment capability with alignment accuracy of <1µm • Minimum resolution capabilities <3µm in contact exposure mode
Charges:
   User operated: NA/hour, Staff operated: NA/hour
 
  Instrument Manufacturer URL: https://www.evgroup.com/
 
  Detailed Specifications: 
   https://www.evgroup.com/products/bonding/bond-alignment-systems/evg6200-infinity-ba/