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Thermal processing: HMDS Oven (Yield Engineering System YES-310TAE)

equipment

Institute of Materials Research and Engineering (IMRE)

2 Fusionopolis Way, Innovis, #08-03 Singapore 138634

"What is it?
Vacuum priming oven for wafer surfaces with hexamethyldisilizane (HMDS) to improve the adhesion of photoresist.

Manufacturer: YES

Model Name: 310TA

Applications: Promote adhesion of photoresist to substrate: - Make positive photoresist act like negative - Tailor the slope of the photoresist profile for higher resolution / lift-off

Instrument Overview: The system can typically be used for three two applications: - Vacuum baking - Vapour priming with HMDS

Technical features and specifications:
Temperature control and stability: Up to 160ºC, ±1ºC Capacity: 4X4” and 2X6” wafer cassettes Throughput: HMDS related: 2 loads/hr For Image Reversal: 1 load/hr

Charges:
NA

Instrument Manufacturer URL: https://yieldengineering.com/ta-series/

Detailed Specifications:
NA

"

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Thermal processing: HMDS Oven (Yield Engineering System YES-310TAE)

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